July 18, 2014
CPC503 Module based on the 3rd Generation of Intel Core CPU is available for ordering.
New СРС503-02 module in 6U CompactPCI format is intended for use in industrial, transport and defense automated control systems. Support of PICMG 2.16 specification enables to build highly reliable multiprocessor computing systems based on СРС503-02. When using additional graphics accelerators in XMC format (module is equipped with a relative slot), processing capacity of such a system could reach up to several teraflops, which describes the system as highly efficient. The 3rd generation Intel Core CPU (Ivy Bridge) has a 22 nm technology and differs from the 2nd generation CPUs by increased performance of: computing kernel – up to 20 %, and graphics kernel – more than by 30 %. Moreover, the graphics kernel supports DirectX 11, Open GL 3.1 and Open CL 1.1 specifications, which extends software development opportunities.
The new CPU made it possible to use RAM, operating on a high-speed 1600 MHz bus. The board’s RAM total volume may reach up to 8 GB, meeting requirements of complex application tasks, designed for quad-core processors. The microchips are soldered on the board which enables the module to withstand high vibration and shock loads. It should also be noted that the use of low-voltage DDR3L memory additionally reduced module’s thermal design power.
Soldered SSD in new version of CPC503 module has been increased up to 8 GB, which will enable developers to use the most up-to-date versions of integrated operating systems.
Using PCI Express integrated controller in the new СРС503-02 version has virtually doubled the rate of date exchange with XMC mezzanine and rear I/O module. In addition, the ХМС mezzanine has now two USB 3.0 channels available.
Video system capabilities have been extended: the new СРС503-02 module is capable of displaying independent pictures to three monitors with DVI-I interfaces or DisplayPort.
For system integrators, upgrading their 6U CompactPCI systems of the previous generations (particularly on СРС501 modules), BIOS settings enable a forced limitation of the thermal design power. Due to this feature, developers can replace the legacy board with the modern one without making any changes to enclosure and heat dissipation structure.
СРС503-02 is manufactured in two versions – 4НРand 8НР – depending on the CPU performance, as well as in two climatic versions – for commercial (0..+70 °C) and industrial (–40..+85 °C) applications.
Your primary contact: Denis Zhiltsov (Senior International marketing manager, Fastwel)
E-mail: [email protected]
Fastwel for more than 15 years has been one of the leading companies developing and manufacturing rugged Single Board Computers for mission-critical applications in transport, military and defense, security and telecom. We deliver CPU modules for aerospace equipment, industrial automation and process control systems. Besides standard products manufacturing, Fastwel offers a full range of OEM and ODM services. To learn more, visit www.fastwel.com.