PICMG Embedded World 2023

PICMG Announcements

COM-HPC & COM Express

PICMG COM-HPC Mini working group reaches key milestone in record time

PICMG Ratifies COM-HPC FuSa Extensions, COM Express PCIe 4/USB 4 Updates to Meet Edge Workload Demands


PICMG Committee to Develop New Modular Box PC Open Specification

CompactPCI Serial

A Fresh Look at CompactPCI Serial


The evolution never ends: PICMG announces new MicroTCA specifications

Floor Presentations

Tuesday, March 14th

1:30 – 3:30 PM, Booth 3-159, Kontron Press roundtable

3:00 PM, HONG KONG Room, PICMG Press Conference

Wednesday, March 15th

12:00 PM, Exhibitor’s forum/Booth H2-501  Samtec & PICMG: Exhibitor’s Forum – PICMG COM-HPC – What’s New in 2023?

2:00 PM, Booth 1-500  ModBlox7 Panel discussion featuring EKF, Ci4Rail, Pheonix Contact and Eltec

2:30 PM, Booth 1-500 MicroTCA Panel discussion featuring powerBridge, N.A.T. and IoXos

3:00 PM, Booth 1-500 COM-HPC Panel discussion featuring congatec, Connect Tech, samtec

Thursday, March 16th

10:15 AM, Weka-VIP Stage, congatec COM-HPC interview

2:15 PM, Embedded World Conference, COM-HPC Server-on-Modules for Modular Edge Server Deployments

Member Exhibits

Member Booth # Member Booth #
Acromag 1-115 ADLINK Technology 3-147
Supermicro 1-208 Eurotech 3-153
Hartmann Electronic 1-211 HARTING 3-156
ARBOR Technology 1-253 Kontron 3-159
AAEON 1-306 ENGICAM 3-225
SECO 1-310 Portwell 3-231
AXIOMTEK Deutschland 1-330 congatec 3-241
Yamaichi Electronics 1-341 TQ-Systems 3-257
EKF Elektronik 1-406 IBASE 3-351
ept 1-407 Sealevel 3-359
Connect Tech 1-430 Ci4Rail 3-544
PHOENIX CONTACT 1-434 powerBridge 3-544
nVent Schroff 1-441 N.A.T. 3-544
iWave 1-457 IOxOS 3-544
Embedded Computing Design 1-500 Eltec 3-544
Avnet Embedded 1-510 Avalue Technology 3-550
Elma Electronic 1-555 POLYRACK TECH-GROUP 3-554
AMI 2-200 Hirose Electric 3A-211
esd electronics 2-358 Texas Instruments 3A-215
Trenz Electronic 2-409 Keysight Technologies 4-208
ASUS IoT 2-410 dSPACE 4-327
Knowledge Resources 2-416 Samtec 4A-324
DFI 2-631 Robert Bosch 4A-334

Selection of Member Demos

Company Name

Booth #

Demo Description

ADLINK Technology, Inc. 3-147 Express-RLP [13th Gen Intel Core based]  COM-HPC-cRLS [13 Gen Intel Core based]  Express-VR7 [AMD V3000 based]
Avnet Embedded 1-510 Full range of COM Express and COM-HPC modules at Embedded World, including live demos using our modules in various environments.
congatec 3-241 Lots of COM-HPC modules and some COM Express
N.A.T. 3-544 MTCA-based canny edge detection with FPGA
Samtec 4A-324 COM-HPC connector sample boards for customers to “see” and “feel”.
Sealevel Systems, Inc. 3-359 12009 Compact Type 6 evaluation carrier board and the HazPAC 10 Rugged Panel PC on display for demo purposes (COM Express-based systems).
SECO 1-320 SECO will show its portfolio of COM Express and COM-HPC boards based on a range of x86 processor technologies.

Member Announcements

 Avnet Embedded

Avnet Embedded launches powerful module family in the COM Express Compact form factor with 13th Gen Intel Core processor


Accelerating Technology Innovation for Autonomous Driving


congatec presents first COM-HPC mini modules at embedded world 2023 – congatec


Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023


COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing

18933-1-intel-rpl-p-kontron-solution-brief-v4 (1)


EKF Elektronik announces CompactPCI processor boards with 11th Gen Intel Core and Xeon processors


Zero8 for ModBlox7

Selection of Featured Products

Company Name Booth # Featured Products
ADLINK Technology, Inc. 3-147 Express-RLP [13th Gen Intel Core based]  COM-HPC-cRLS [13 Gen Intel Core based]  Express-VR7 [AMD V3000 based]
epzt GmbH 1-407 ModBlox7  80 pin board-to-board connector  plug ept p/n 405-51080-51  socket ept p/n 406-51080-51
nVent SCHROFF 1-441 ATCA system with EMC shielding up to 40 GHz, MTCA.4 System, CPCI System for railway onboard applications
Avnet Embedded 1-510 MSC HCA-RLP – Avnet Embedded expands its COM-HPC® product portfolio for high-performance computing applications and presents the new MSC HCA-RLP module family. The powerful COM-HPC Client modules integrate a 13th Gen Intel® Core™ processor giving application designers a great variety of choices of power efficient and performant compute solutions. The powerful  MSC C6C-RLP COM Express™ Type 6 module family in the Compact form factor integrating an 13th Gen Intel® Core™ processor.
SECO 1-320 CALLISTO: COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)    EUPHORIA: COM Express® 3.1 Type 6 Compact Module with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (formerly Elkhart Lake)
congatec 3-241 COM-HPC Mini Module (preview)

Conference Presenters

Jessica Isquith is the President of the PICMG consortium of companies and organizations that collaboratively develop open standards for embedded computing applications. She has over twenty years of leadership experience in the Embedded Computing industry. Her roles have included President of Aurora Technologies and Vice President of Marketing at Carlo Gavazzi / SIE Computing Solutions. Jessica is the founder of TISOAA, which provides strategic marketing services to a wide array of emerging technology companies. She holds bachelor’s and master’s degrees in engineering from Tufts University.






Mathias Beer is currently employed at Ci4Rail, since September 2020, holding the title of Chief Product Officer. Previously, Mathias held the position of Director Global Technical Solutions, Director Global Marketing, while working at duagon Germany. Mathias held this role for 6 years (March 2015 – October 2020). Before this, Mathias held the position of Director Customer Relationship Management, while working at duagon Germany. Mathias occupied this position for 2 years (March 2013 – April 2015). Previously, Mathias held the position of Head of Product Management, while working at duagon Germany. Mathias held this role for 3 years (January 2010 – March 2013). Before this, Mathias held the position of Product Management, while working at duagon Germany. Mathias occupied this position for 24 months (January 2008 – January 2010). Previously, Mathias held the position of Project Management, while working at duagon Germany. Mathias held this role for 24 months (January 2006 – January 2008). Before this, Mathias held the position of IC Design, while working at duagon Germany. Mathias occupied this position for 4 years (December 2001 – January 2006).
[email protected]



Heiko Koerte is with N.A.T. since almost 26 years and responsible for the world wide sales and marketing activities of N.A.T.. Before having been appointed VP and Director Sales & Marketing back in 2000 he was leading the Software Development at N.A.T. for more than eight years. Due to his strong background in engineering he still is personally involved in the definition of all strategic hardware and software products at N.A.T.. He holds a diploma degree in Physics of Bonn University in Germany.
[email protected]








Christian Eder is co-founder and director product marketing at congatec. With 30 years of experience in embedded computing, he chairs the COM-HPC working group of PICMG. He is also active in a number of PICMG working groups and served as editor of the following specifications: COM Express 2.0, COM Express 2.1, COM Express Design Guide, Embedded EEPROM, Embedded EAPI, and COM Express 3.0. Christian is also a board member of SGET and editor of the SMARC 2.0 and 2.1 specification. He has a degree in electrical engineering from the University of Applied Sciences Regensburg, Germany.
[email protected]