• Intel® Core™ Ultra 7 and Intel® Core™ Ultra 5 with 15 W / 28 W TDP
• New Chiplet-Technology for optimized high-speed interconnect and improved power eficiency
• Up to 14 CPU Cores based on Intel® Hybrid-Technology with various combinations of Performance-Cores and Efficient-Cores
• Deliver stunning graphics and AI-focused performance
• High-bandwidth extandability through up to 16 PCIe Gen4/5 lanes
• High-speed peripheral and network interfaces with USB 3.2 Gen2 (10 Gb/s) and 2x 2.5 Gigabit Ethernet
• USB 4 / USB-C support
• COM-HPC® Mini formfactor for extremely compact integration
The COM-HPC Mini Module TQMxCU1-HPCM equipped with Intel® Core™ Ultra processors offers impressive performance data in the field of AI and graphics for the edge. Traditional use cases in industry, healthcare, communication and security thus can be extended and benefit from the latest technology: Several different compute engines work together to accelerate inference tasks directly on site, for example, while reducing the need for a discrete accelerator. The latest manufacturing technology ensures particularly good power efficiency, enabling simplified cooling solutions and fanless designs. The feature set of the processors can be optimally made available via the 400-pin high-speed connector of the COM-HPC Mini standard. In combination with the extremely compact dimensions of just 95 mm x 70 mm, innovative solutions can be implemented in the smallest of spaces. The soldered LPDDR5 memory on the top significantly simplifies thermal integration into systems, as all critical components can be optimally connected and heat build-up between components is avoided.
