Member Press Releases archive
July 18, 2018 Application Brief: nVent/Schroff Develops 3U MicroTCA.4 Chassis for High-Energy Physics Experimentation
November 13, 2019
COM-HPC pinout approved PICMG and congatec announce that the PICMG COM-HPC technical subcommittee approved the pinout of this new high-performance Computer-on-Module specification. The new [...]
November 9, 2019
New COM specification will meet the increasing server-level requirements of high-end edge-computing applications. By Max Maxfield for EEWeb| Things are really starting to heat up [...]
June 21, 2019
New effort will provide module level, high performance server computing technologies Highlights: New Computer-On-Module open specification for high-performance edge computing Support for high [...]
June 19, 2019
“Take the Smart Sensor Challenge” illustrates how to create Plug-and-Play Interoperability with 4-20mA sensors Highlights: Promotion introduces new open approach to sensor interoperability Extend [...]
May 29, 2019
by Mathew Dirjish, Sensors Online | When you ponder an entity the magnitude of the IoT and Industrial IoT, two things become readily evident. First, all the devices on the network near [...]
July 18, 2018 Application Brief: nVent/Schroff Develops 3U MicroTCA.4 Chassis for High-Energy Physics Experimentation