Micro Telecommunications Computing Architecture Base Specification

The PICMG® Air Cooled Rugged Micro Telecommunications Computing Architecture (MicroTCA®) specification defines the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in MicroTCA.0. MicroTCA.0 as defined provides support for requirements such as NEBS, ETSI and ITU specifications, which are focused on the central office telecommunication environment. This specification, which must be used in conjunction with MicroTCA.0, provides the additional requirements necessary for a System with the additional capabilities to meet the more rugged requirements of outside plant telecom, industrial and aerospace environments. In addition it defines the test setups required to test MicroTCA components and Systems This MicroTCA.1 specification is focused on using forced-air as the cooling medium.

This PICMG^® Micro Telecommunications Computing Architecture (MicroTCA^®) Hybrid Air/Conduction Cooled MicroTCA Specification (MicroTCA.2) defines the requirements for a system that meets more stringent levels and cycles of temperature, shock, vibration, and other environmental conditions than those defined in the MicroTCA Base Specification (MicroTCA.0) and the Air Cooled Rugged MicroTCA Specification (MicroTCA.1). MicroTCA.0 as defined provides support for requirements such as NEBS, ETSI and ITU specifications, which focus on the central office telecommunication environment. This specification provides the additional requirements necessary for a system with the capabilities needed to meet the more rugged requirements of outside plant telecom, machine and transport industry, and military airborne, shipboard and ground mobile equipment environments.

This PICMG^® Micro Telecommunications Computing Architecture (MicroTCA^®) Hardened Conduction Cooled MicroTCA Specification (MicroTCA.3) defines the requirements for a system that meets more stringent levels and cycles of temperature, shock, vibration, and other environmental conditions than those defined in the MicroTCA Base Specification (MicroTCA.0) and the Air Cooled Rugged MicroTCA Specification (MicroTCA.1). MicroTCA.0 as defined provides support for requirements such as NEBS, ETSI and ITU specifications, which are focused on the central office telecommunication environment. This specification provides the additional requirements necessary for a system with the capabilities needed to meet the more rugged requirements of outside plant telecom, machine and transport industry, and military airborne, shipboard and ground mobile equipment environments.

The PICMG^® MTCA.4 Standard describes the extended sub-rack with rear I/O to a Rear Transition Module through fabric connectors in the upper area above the standard µTCA backplane area, defined by PICMG MTCA.0 as Zone 3. The MTCA.4 design anticipated but did not specify an auxiliary backplane located behind and separate from the standard MTCA.4 dual star backplane; the purpose was to allow specialized signal communication to the µRTMs themselves which were generally conceived to contain Analog Front End (AFE) signal conditioning circuits including amplifiers, Analog to Digital converters, filters and calibrators.

This guideline defines the functions and Application Programming Interfaces (APIs) for the Standard Process Model (SPM) developed for the MTCA.4 effort within PICMG.

This guideline defines standard operating and usage models and the Application Programming Interface (API) of the MTCA.4 PCI Express hot plug implementation.