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COM-HPC™ is a new Computer-on-Module standard designed specifically for High-Performance Computing. It does not replace the COM Express standard, but extends the Computer-on-Module idea to very powerful client and server-class processors, providing an unmatched infrastructure of high-end interfaces.COM-HPC is governed by the PICMG industrial group where it has recently been created by an international workgroup consisting of COM manufacturers including Avnet Integrated, semiconductor companies and infrastructure providers.
COM-HPC™ by Avnet Integrated | Designed by Avnet Integrated
ADLINK COM Express Type 6 compact size cExpress-AR module features AMD Ryzen™ Embedded V2000 Series SoC with high-performance integrated AMD Radeon™ graphics. The cExpress-AR is the first Type 6 module on the market to support an AMD Ryzen Embedded 8 CPU core embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier quad-core AMD Ryzen Embedded V1000 Series SoC, the additional cores combined with the AMD “Zen 2” cores result in 15% IPC uplift, and double the performance-per-watt efficiency.
ADLINK’s cExpress-AR provides standard support for up to 64GB DDR4 in two SO-DIMMs. ECC memory support is available on selected SKUs as well as configurable TDP (down to 10W), while still offering 6 to 8 cores and passive cooling, making the V2000 Series well suited for mission critical application in harsh environments.
For further information about cExpress-AR, please visit: https://www.adlinktech.com/Products/C…
COM Express module supporting AMD Ryzen V2000 octa-core (8 core) SoC
Jan Marjonovic presentation – Chisel Community Conference 2020
Tester for Multi-port Chisel Modules with Bus Functional Models Copy
New state-of-the-art Computer-on-Modules – The feature set in detail. congatec supports the 11th Gen Intel® Core™ processor, known under the code name Tiger Lake UP3, on COM Express conga-TC570 based on the new low-power high-density SoCs the new modules offer significantly greater CPU performance and nearly 3x higher GPU performance along with state-of-the-art PCIe Gen4.
conga-TC570 – high-performance COM Express based on 11th Gen Intel® Core™ processors
Hardware management is needed in applications that require high system availability with minimum downtime. Our experts will give a short introduction about Hardware Management technology for open standards such as AdvancedTCA, MicroTCA and VPX.
Episode 6: nVent SCHROFF Hardware Management Capabilities
Learn more about the Concurrent Technologies Compact PCI Processor Board – PP B7x/msd
PP B7x/msd – Product Overview
PICMG CTO Doug Sandy explains what the standards body is doing at the last foot of the network, using a demo that shows how binary time-series data from an analog sensor is communicated over a serial interface, converted into JSON format, and transported to the enterprise via Ethernet. Besides making the last foot of IoT networks plug n’ play, Doug provides a sneak peek at COM-HPC.
How to Make the Last Foot of IIoT Networks Plug n’ Play
The Internet of Things suffers from a lack of common data models. Interestingly enough, PICMG, traditionally a hardware standards organization, is helping developing data models based on open source software as a possible remedy. Here, Doug Sandy CTO of PICMG uses a simple CNC machine to deconstruct the complexity, and also alludes to a potential standard, postage-stamp-sized hardware platform that will help fulfill the IIoT vision for embedded engineers.
