The MSC HSD-ILDL COM-HPC Server module hosts the Intel® Xeon® D-1700 processor and delivers server class performance on embedded form factor. The processor is a fully integrated System on Chip (SoC) combining up to ten Xeon cores, memory controller, high bandwidth network and multiple PCIe root complexes on a single socket.
The on-chip network controller facilitates up to eight Ethernet ports with different configuration options ranging from 1G to 25G per port and an aggregated throughput of up to 100G. An additional Ethernet port based on Intel® i225 provides 1GbE/2.5GbE bandwidth and TSN capability for real-time applications. An extensive set of PCI Express lanes with Gen 4 and Gen 3 support allow for connecting external HW accelerators, FPGAs, storage and IO devices.
The user can scale memory capacity from 8GB to 256GB based on registered DIMMs (RDIMM) or unbuffered DIMMs (UDIMM). Machine robustness can be extended by enabling error correction code (ECC) and utilizing RDIMM or ECC UDIMM. Selected variants of the MSC HSD-ILDL can be operated at extended temperature range with true 24/7 utilization. This supports system designs exposed to harsh environmental conditions that require a reliable compute engine.
System investments are well protected through long-term availability of the module. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
