August 3, 2021

Basis for new PICMG COM-HPC^®Interconnect Solutions

New Albany, IN: Samtec Inc., a privately held $800 MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the release of next-gen AcceleRate HP High-Performance Arrays. AcceleRate HP supports 112 Gbps PAM4 extreme performance in an ultra-micro footprint.AcceleRate HP High-Performance Arrays feature an open-pin-field array which maximizes grounding and routing flexibility. System architects can route high-performance differential-pairs, single-ended signals and high-current voltage rails via the same interconnect.Additionally, the 2.2 / 2.4 / 2.2 mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and the ability to add more ground vias around the differential signals.“Samtec’s new AcceleRate HP High-Performance Arrays set the standard for high-speed 112 Gbps PAM4 performance in a small form factor,” said Michael Boone, Product Manager, High-Speed Board-to-Board at Samtec, Inc. “Fast-growing applications such as AI accelerators, ASIC emulators and next-gen edge computing platforms leverage these unique benefits.”

Key AcceleRate HP High-Performance Arrays features include:

Dense 0.635 mm pitch
Low-profile 5 mm and up to 10 mm stack heights
Up to 400 total pins available
Roadmap to 1,000+ pins
Data rate compatible with PCIe® 5.0 and 100 GbE
BGA termination for easy assembly and self-alignment

For more information on AcceleRate HP High-Performance Arrays, please visit www.samtec.com/accelerateHP.

The new PICMG COM-HPC Specification provides system and interface flexibility by adopting a pair of 400 pin connectors based on Samtec’s AcceleRate HP High-Performance Arrays. Samtec COM-HPC Connectors link carriers to Server and Client modules. They support existing and future interfaces such as PCIe 5.0 and up to 100 GbE. The connector pairs support either a 5 mm or 10 mm stack height.

For more information on Samtec COM-HPC Connectors, please download the COM-HPC Interconnect Solutions eBrochure, visit www.samtec.com/COMHPC or e-mail our technical experts at [email protected]>.

About Samtec
Founded in 1976, Samtec is a privately held, $800 MM global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.

Samtec, Inc.
P.O. Box 1147
New Albany, IN 47151-1147
USA
Phone: 1-800-SAMTEC-9 (800-726-8329)
www.samtec.com

For more information please contact:
Matt Burns
[email protected]
812-944-6733