F17 – 3U CompactPCI®/Express Core 2 Duo SBC


MEN Mikro Elektronik GmbH


Angela Bieber

Manufacturer's Product Page

F17 – 3U CompactPCI®/Express Core 2 Duo SBC


(cPCI) Boards - 3U Processors

Equipped with the Intel® high-performance Core 2 Duo processor T7400 running at 2.16 GHz or the low-voltage L7400 at 1.5 GHz, the F17 is a versatile 4HP/3U (single-slot, single-size Eurocard) single-board computer based on the 64-bit multi-core processor architecture from Intel®. It is designed especially for embedded systems which require high computing and graphics performance and low power consumption.
The F17 offers a 32-bit/33-MHz CompactPCI® bus interface and can also be used without a bus system. In combination with a specific side card it can also perform system-slot functionality in a CompactPCI® Express system.
A total of six PCI Express® lanes for high-speed communication (such as Gigabit Ethernet, graphics) are supported on the F17. 2 x1 PCIe® links are used for the two onboard Ethernet interfaces. 4 x1 or 1 x4 PCIe® links are available on a specific side card.
The DDR2 DRAM is soldered to F17 to guarantee optimum shock and vibration resistance. A robust IDE CompactFlash® device offers nearly unlimited space for user applications. In addition to parallel ATA, two serial ATA lines are available.
The F17 can be extended by different side cards. Additional functions include two digital video inputs for flat panel connection via DVI, a variety of different UARTs or another four USB 2.0 ports, SATA for hard disk or RAID connection and HD audio.The F17 is also prepared for rear I/O where for example another two USB 2.0 ports can be connected.
The F17 operates in Windows® and Linux environments as well as under real-time operating systems that support Intel®’s multi-core architecture. The Award BIOS was specially designed for embedded system applications.
The F17 is suited for a wide range of industrial applications, e.g. for monitoring, vision and control systems as well as test and measurement. Main target markets comprise industrial automation, multimedia, traffic and transportation, aerospace, shipbuilding, medical engineering and robotics.
The F17 comes with a tailored passive heat sink within 4 HP height. Anyhow, forced air cooling is always required inside the system. The robust design of the F17 make the board especially suited for use in rugged environments with regard to shock and vibration according to applicable DIN, EN or IEC industry standards. The F17 is also ready for coating so that it can be used in humid and dusty environments.