Express-IBR

Manufacturer

ADLINK Technology Inc.

Contact

Elsie Chen

Manufacturer's Product Page

Express-IBR

Datasheet

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Category

COM Express - Rugged Modules & Systems

Extreme Rugged COM Express® Type 6 Computer-on-Module with 3rd Generation Intel® Core Processor and QM77 Chipset

Features
– Quad/dual core 3rd Generation Intel® Core Processor with Mobile Intel® QM77 Express Chipset
– Up to 16GB ECC 1600MHz DDR3 memory in two SODIMM sockets
– Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO
– Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1)
Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit Ethernet, USB 2.0, 4 USB 3.0
– 50% Thicker PCB for high vibration environments