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ACPS3320: 3U cPCI® Serial Carrier Card for AcroPack Modules

The ACPS3320 is a 3U CompactPCI Serial carrier card for Acromag’s AcroPack mezzanine modules. Two I/O expansion slots interface AcroPack or mini PCIe modules to the PCIe bus. All connections to field signals are made through rear backplane connectors on the carrier board which passes them to the individual AcroPack modules.

• 3U CompactPCI Serial
• Two I/O expansion slots (AcroPack® or mPCIe)
• Rear I/O access

Select from 25+ AcroPack modules to install any combination of analog I/O, digital I/O, serial I/O, communication, and FPGA processor functions. This modular approach allows the user to create a board which is customized to the application, thus saving slots and reducing costs.

The AcroPack product line updates our popular Industry Pack I/O modules with a PCIe interface format. This tech-refresh design offers a compact, low-cost I/O solution with the same functionality and memory map of the original Industry Pack mezzanine modules. New modules offer additional capabilities such as FPGA computing, Ethernet, CAN bus, and avionics interfaces.

These carriers are ideal for high-performance systems in aerospace, defense, transportation, oil/gas, test/measurement, manufacturing, and scientific research applications. End-users and system integrators benefit from a broad range of I/O functions in a small form factor.

ACPS3310: 3U cPCI® Serial Carrier Card for AcroPack Modules

The ACPS3310 is a 3U CompactPCI Serial carrier card for Acromag’s AcroPack mezzanine modules. Two isolated I/O expansion slots interface AcroPack or mini PCIe modules to the PCIe bus. All connections to field signals are made through front panel connectors on the carrier board which passes them to the individual AcroPack modules.

• Front I/O access
• Two isolated I/O expansion slots (AcroPack® or mPCIe)
• PCI Express Version 2.1 complaint carrier

Select from 25+ AcroPack modules to install any combination of analog I/O, digital I/O, serial I/O, communication, and FPGA processor functions. This modular approach allows the user to create a board which is customized to the application, thus saving slots and reducing costs.

The AcroPack product line updates our popular Industry Pack I/O modules with a PCIe interface format. This tech-refresh design offers a compact, low-cost I/O solution with the same functionality and memory map of the original Industry Pack mezzanine modules. New modules offer additional capabilities such as FPGA computing, Ethernet, CAN bus, and avionics interfaces.

These carriers are ideal for high-performance systems in aerospace, defense, transportation, oil/gas, test/measurement, manufacturing, and scientific research applications. End-users and system integrators benefit from a broad range of I/O functions in a small form factor.

CompactPCI Serial Chassis Platforms

The HEITEC HeiPac Vario VM-R CPCI-S is a 4U vertical-mount chassis that holds up to eight 3U slots at a 0.8” pitch. The modular card guides can be adjusted to allow 1.0” pitch or other spacing in .2” increments. The standard PSU is a fixed 350W ATX, but other options are available. Conduction-cooled card guides are also available for testing and development. The chassis is 42HP wide, other versions are available in 19″ rackmount or specialty sizes.

The HeiPac Vario VM-R CPCI-S has various power and backplane configuration options. Consult HEITEC for off-the-shelf options and tailored configurations.

– 4U vertical-mount chassis platform that accepts 3U CompactPCI Serial boards
– Supports RTMs for rear I/O
– Up to 8 slots at 0.8” pitch
– Card guides can be adjusted in .2” increments to accept various slot pitches
– Bottom-to-top cooling configuration. Front-to-rear cooled version is also available.
– Fixed 250W ATX (other PSU options are available upon request)
– Low cost design
– Optional rubber “feet” for desktop applications
– Customization available