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F12N – 3U CompactPCI® MPC5200B SBC

Equipped with the MPC5200B PowerPC®, the F12N single-board computer is a versatile 3U Eurocard CompactPCI® board that operates at up to 400 MHz and 700 MIPS. The F12N is designed especially for systems which require low power consumption and mechanical robustness. With the processor consuming less than 1 W, the board is delivered for -40 to +85°C operation temperature. All components on the board are soldered. The F12N is thus well placed as a rugged computing platform for mobile applications, offering the whole world of Linux based software and real-time operating support for VxWorks® and QNX®.

The F12N is equipped with an onboard soldered SDRAM of up to 256 MB and up to 1 GB NAND Flash as well as with 16 MB additional SDRAM, up to 8 MB boot Flash and 2 MB battery-backed SRAM.

The SBC provides two Fast Ethernet interfaces, one serial line and USB 1.1 at its front panel. As an alternative to RJ45, D-Sub connectors guarantee reliable functions also in harsh environments. Two CAN controllers with V2.0A/B CAN protocol are included in the MPC5200B and are accessible via SA-Adapters. A second serial interface can be accessed using an SA-Adapter on the F12N. (E)IDE and GPIO are also on board.

The large FPGA on the F12N allows to realize additional user-defined functions such as graphics, touch, further serial interfaces, further CAN bus controllers, binary I/O etc. for the needs of the individual application in a very flexible way. Before boot-up of the system, the FPGA is loaded from boot Flash. Updates of the FPGA contents can be made inside the boot Flash during operation. The FPGA functions can be physically implemented by using SA-Adapters. A maximum of 8 SA-Adapters can be used on the F12N and I/O can be made accessible at the front panel.

Equipped with a PCI-bridge chip, the F12N offers a full CompactPCI® interface (system slot functionality) for reliable system expansion.

The F12N comes with MENMON support. This firmware/BIOS can be used for bootstrapping operating systems (from disk, Flash or network), for hardware testing, or for debugging applications without running any operating system.

CPCI-CPU/5201

CompactPCI® PowerPCTM Board with CAN, ETHERNET and USB

Cost effective 3U/4HP CompactPCI CPU Board
– MPC5121e CPU with e300 core and 400 MHz / 760 MIPS
– Flexible and fast storage via CompactFlash®-card and USB connector
– CAN, 1 Mbit/s, electrically isolated
– Linux®, QNX® and VxWorks® BSPs available
– CANopen®, J1939 and ARINC 825 protocol available
– EtherCAT® Master stack available

Longevity Program of FreescaleTM
– Enhanced availability: the CPU is included in the longevity program of FreescaleTM
– Low power consumption

Wide Storage Support (ATA, SDHCTM)
– CompactFlash card slot
– On request ATA devices and SDHC CLASS 10
– On request on-board storage eMMCTM and Magnetoresistive RAM (MRAM)

XPedite6032

The XPedite6032 is a high-performance conduction- or air-cooled 3U CompactPCI (cPCI) module that dissipates less than 18 W and is capable of operating at up to 85°C at the external thermal interface without forced air flow (conduction-cooled version) or up to 55°C ambient air temperature with 300 LFM airflow (air-cooled version). The XPedite6032 can also host one single-width conduction-cooled PMC or standard air-cooled PMC. The XPedite6032 is tolerant of 40 g peak/6 ms half sine shock, random vibration of 0.1 g²/Hz from 50 to 2000 Hz, and swept sinusoidal vibration of 0.06 inch/10 g peak amplitude from 10 to 500 Hz.

The XPedite6032 utilizes the Freescale MPC7447A/7448 embedded processor and Marvell Discovery III system controller and provides up to 512 MB DDR-266 SDRAM, up to 128MB of NOR flash, two RS-232/RS-422 serial ports, a 33/66 MHz cPCI interface and 66/100/133MHz PCI-X PMC interface. The serial and two Gigabit Ethernet interfaces are accessible through the backplane J2 connector along with a subset of the PMC’s P14 I/O. The XPedite6032 can be built as a system or peripheral cPCI module.

The XPedite6032 is ideal for 3U cPCI applications in commercial or extended temperature, shock, and vibration environments that require high bandwidth and processing performance.