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AMC-D24A4-RFx

The AMC-D24A4-RF2/RF4 is an extremely high performance ARM, DSP and FPGA based processing card which includes two or four integrated, flexible, wideband RF transceiver channels.

The module is aimed at LTE, LTE Advanced and 5G systems that require MIMO technologies and enables complete RF to Layer 3 wireless basestation functionality to be implemented on a single AdvancedMC card.

The module’s main processor is the TCI6638 KeyStone II DSP/ARM SoC. It includes eight C66x+ DSP cores, as well as four ARM Cortex-A15 cores for higher layer processing. The module also has two TMS320C6678 octal C66x core DSPs. All processors are closely coupled via TI’s Hyperlink interface and the Ethernet infrastructure of the card with Serial RapidIO (SRIO) backplane connectivity providing inter-card connectivity. There is also a large Kintex-7 FPGA for additional co-processing and to manage the RF interfaces.

A version with no RF channels, the AMC-D24A4, is also available.

SAMC-709

The SAMC-709 is a Single Full-Size board implemented as AdvancedMC (AMC) card. It is optimized for FPGA processing applications, especially high-performance processing (HPC) applications.

A key feature of the SAMC-709 is a 8 high-speed links which can be used as PCI Express x4/x8, Serial RapidIO x4 and 10Gigabit Ethernet in the same time. It is also equipped with 36MB QDRII static memory and 2GB DDR2 dynamic memory.

SAMC-707

The SAMC-707 is a Single Full-Size board implemented as AdvancedMC (AMC) card. It is optimized for FPGA processing applications, especially high-performance processing (HPC) applications.

A key feature of the SAMC-707 is its dynamic reconfiguration ability so you can dynamically change program on FPGA without switching off. The SAMC-707 also supports Mitrion Virtual Processor for turnkey new applications development or speed modification of existing platforms.