MIC-5604 Advanced Mezzanine Card based on Intel® Xeon® Processor D with DDR4 ECC

The Advantech MIC-5604 is a single-width mid-size general purpose processor AMC module for ATCA or MicroTCA applications. Its design is based on Intel® Xeon Processor D-1500 SoC processors in a BGA package. This AMC module supports processors with integrated memory controllers, and a maximum cache of 6MB. It can support up to 8/16 GB, dual-channel, on-board DDR4 memory with ECC at 2133/1866 MHz, making it ideal for mission critical applications requiring low latency and reliable memory access.

For graphics or control applications the front panel HDMI port provides the Display support.

As standard feature, external Ethernet connectivity is provided on two dedicated GbE front panel ports, one each from the onboard Intel® I350 AM4 quad port LAN controller, which also provides two additional GbE ports to the AMC base fabric. The Intel® I350 supports remote management capabilities with KVM over LAN as well as introducing faster I/O than previous generation designs with SATA-III to AMC ports 2..3 and PCIe x4 gen.2 to ports 4..7. This module can also be configured to boot from the network, M.2 SSD, or external storage media such as HDD or USB drives.

To enable maximum application flexibility, the MIC-5604 is not only designed to support PICMG AMC sub-specifications such as AMC.1/.2/.3, it also has a fabric expansion mezzanine interface that allows the implementation of standard or customized mezzanine modules that offer enhanced fat pipe connectivity and I/O support.

A dedicated Module Management Controller (MMC) monitors onboard conditions and manages hot swap operation, module replacement and field upgrades without the need to power down the carrier system.

RackPak/M5-1, the next step MTCA.4 chassis

The RackPak/M5-1 MicroTCA® chassis is a 2U 19″ rack offering up to 6 AdvancedMC™ slots, 5 of them are MTCA.4 compliant slots with up to 5 µRTMs. The RackPak/M5-1 system is the perfect base for small and low cost computer platforms in medical, industrial automation, transportation, military, and telecommunication. It supports high-end computing applications with up to 6 CPU modules as well as I/O intensive configurations. Based on the MicroTCA® and AdvancedMC™ PICMG® standards it is the best solution for long life cycle applications.

The RackPak/M5-1 includes an exchangeable cooling unit, with left-to-right cooling. Other cooling units are available upon request, as the user has to carefully evaluate the overall thermal design of his application. The cooling units are field replaceable, depending on the environmental needs.

The system can be equipped with any double full-size MTCA.0 AC power supply or a high precision 1.000W PSU. Cooling system and PSU are designed for a maximum of 80W power dissipation per slot. The dust filter and the fan cartridge are hot-swappable. An optional DC input power supply is also available.

AMC Front Panels and Filler Panels with Flange uTCA 1.0 Compliant

Atrenne offers a range of Robust AMC front panels and filler panels with a retention flange which enables the user to secure the AMC in the carrier or chassis.

Key features:
-Extruded Aluminum Construction for Rigidity
-Full, Mid, and Compact sizes
-Single or Double Width
-Stainless Steel or Aluminum
-Components, Kits, Assemblies
-Full Range of Customization Options

AMC front panels are comprised of top and bottom blocks, light pipes and ejector handles, plus the M3 captive Screws for fastening

Full range of filler panel sizes with air baffles options

Contact: Atrenne Sales